Browse Prior Art Database

Semiconductor Chip Cleaning Fixture

IP.com Disclosure Number: IPCOM000080913D
Original Publication Date: 1974-Mar-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 39K

Publishing Venue

IBM

Related People

Smith, FJ: AUTHOR

Abstract

This fixture is utilized to remove chips bonded to a slicing block while retaining alignment of the chips in their original wafer oriented positions.

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Semiconductor Chip Cleaning Fixture

This fixture is utilized to remove chips bonded to a slicing block while retaining alignment of the chips in their original wafer oriented positions.

Chip cleaning fixture 10, Fig. 1, is composed of a plate 12 having a cutout pocket corresponding to the pattern of active semiconductor chips 18 left on a chip dicing block 16 after the dicing operation, which includes removal of all waste material. The chips 18 are typically bonded to the dicing block 16 with a glycol bonding material. Aligned with the cutout in plate 12 is a perforated plate 14, through which solvent is allowed to pass to dissolve the glycol bonding material. Fig. 2 shows the relationship between dicing block 16, chips 18, and the fixture 10. The dimensions of the pocket and the thickness of plate 12 are designed to allow only limited movement of chips during the glycol removal process, to maintain chip alignment and prevent damage to the chips 18.

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