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Browse Prior Art Database

Enhancing Plated Copper Adhesion

IP.com Disclosure Number: IPCOM000080923D
Original Publication Date: 1974-Mar-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Ameen, JG: AUTHOR [+3]

Abstract

A one-mil transfer film of PYRALUX* "B" stage resin adhesive removably coated on a MYLAR* polyester or KPATON* polyimide backing is cured concurrently with the resin prepregs to provide, on a printed-circuit product or the like, a surface to which copper will readily adhere when applied by additive processes (e.g., electroless processing alone, or electroless followed by electrolytic processing).

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Enhancing Plated Copper Adhesion

A one-mil transfer film of PYRALUX* "B" stage resin adhesive removably coated on a MYLAR* polyester or KPATON* polyimide backing is cured concurrently with the resin prepregs to provide, on a printed-circuit product or the like, a surface to which copper will readily adhere when applied by additive processes (e.g., electroless processing alone, or electroless followed by electrolytic processing).

In cases where electroless processing is followed by electrolytic, the PYRALUX-impregnated surface should be treated for one minute in a highly concentrated alkaline solution (e.g., Pennsalt's K-2 solution, having a concentration of 8 oz/gal) at 140 degrees F before the electroless plating step.

After copper deposition, the product is baked for 15 minutes at 340 degrees F, providing bonds of the order of about 10 to 20 lbs/in.

Bond strengths in excess of 29 lbs/in can be achieved by laminating the PYRALUX resin with treated aluminum foil on the outer surface.

If preferred, the film or coating of PYRALUX may be applied to the cured laminate in solution form by dipping or spraying. *Trademarks of E. I. du Pont de Nemours Co.

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