Original Publication Date: 1974-Mar-01
Included in the Prior Art Database: 2005-Feb-27
This probe for continuity testing of circuit panels, which lends itself to high-density packaging, does not require soldered joints or a metal sleeve for housing the contact compression spring.
This probe for continuity testing of circuit panels, which lends itself to high- density packaging, does not require soldered joints or a metal sleeve for housing the contact compression spring.
A housing 1, which may be of a moldable, insulative material, is formed with
a plurality of holes 2 each having a larger counterbore 3 which are to accept the
probe assemblies. A probe includes a terminal 4 having soldered thereto a wire
5. The terminal is adhesively secured in counterbore 3. Thereafter, a spring 6 is inserted in hole 2 and a split sleeve 7 having a plunger 8 assembled therein is inserted in hole 2 to compress and contact the spring. The sleeve 7 is held in place by a force fit. The ends of terminal 4 and plunger 8 are conically shaped adjacent to the spring 6 to aid in maintaining spring position. The terminal and plunger ends and end coils of the spring are preferably plated with a precious metal such as gold, to reduce electrical resistance during use.
In Fig. 2 are shown insertion and extraction tools for the sleeve-plunger assembly. In Fig. 2a, the assembly tool 9 is merely a mating cup-shaped rod for pushing the plunger 8 and sleeve 7 into hole 2. The extraction tool 10 of Fig. 2b is a split sleeve having an internal shoulder 11, which will pass over and grip the plunger head.