Browse Prior Art Database

Precision Minimum Contacting Wafer Orientation System

IP.com Disclosure Number: IPCOM000080954D
Original Publication Date: 1974-Mar-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 44K

Publishing Venue

IBM

Related People

Fischl, JJ: AUTHOR [+2]

Abstract

This wafer orienting and positioning system employs an air bearing, a capstan drive, a fixed notch locating pin and a precision gage pin for extremely accurate and repeatable positioning of a wafer, with a minimum of wafer contact and handling.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 60% of the total text.

Page 1 of 2

Precision Minimum Contacting Wafer Orientation System

This wafer orienting and positioning system employs an air bearing, a capstan drive, a fixed notch locating pin and a precision gage pin for extremely accurate and repeatable positioning of a wafer, with a minimum of wafer contact and handling.

Air slide 1 having directional air jets 7 conveys wafer 2 to orientation station 10 where the wafer is oriented and positioned for an operation, such as projection printing and/or serialization identification. Wafer 2 is then conveyed in a controlled manner from orientation station 10 to a downstream station, not shown, for a subsequent operation.

Capstan drive 3 is located at an angle of 90 Degrees relative to fixed notch locating pin 4 on a pedestal 5. Capstan drive 3 has tracking surface 11 of, for example, urethane rubber. Capstan drive 3 is mounted on an elevator so that it can be retracted below the surface of slide 1. Pedestal 5 also contains retractable gage pin 6, orientation flow jets 12, wafer chucking vacuum ports 12 (combination), and notch locating sensors 8A and 8B. Pedestal 5 is mounted on a diaphragm assembly to permit the raising of wafer 2 such as, for example, to a reference ring for photoresist exposure.

In operation, wafer 2 is conveyed by input air slide 1 such that the wafer does not make contact with notch locating pin 4 upon its arrival at pedestal 5, due to the slide taper geometry. The flow vector force Qv from jets 12 drives wafer 2 against...