Browse Prior Art Database

Two Pass Laser Cutting

IP.com Disclosure Number: IPCOM000080955D
Original Publication Date: 1974-Mar-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Shah, AS: AUTHOR [+2]

Abstract

Laser cutting of semiconductor wafers into chips is done in two steps, which avoids the buildup of a lip of slag on the edges of the chips.

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Two Pass Laser Cutting

Laser cutting of semiconductor wafers into chips is done in two steps, which avoids the buildup of a lip of slag on the edges of the chips.

In the first step, clean grooves, for example, about 5 mils deep and about 3 mils wide are first cut into the wafer using either mechanical chemical or laser means. The cuts are then completed with a laser having sufficient power and intensity to separate the wafer into chips. The second cut is narrower than the first cut so that it is contained within the width of the groove.

The laser cutting process can be reversed, i.e., by cutting the deep groove first and then making a faster pass with the laser, thus removing the edge buildup made during the first laser cut.

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