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Electroless Cobalt (Boron) Bath

IP.com Disclosure Number: IPCOM000080963D
Original Publication Date: 1974-Mar-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Mescia, NC: AUTHOR [+2]

Abstract

An electroless bath has been developed for depositing cobalt-boron alloy which serves as a gold barrier, as opposed to nickel-phosphorous alloy commonly used on chip pad sites in semiconductor module fabrication. Also, the cobalt boron alloy constitutes a higher melting point alloy than a nickel-phosphorous alloy deposited from a hypophosphite-based bath. An illustrative formulation of the electroless bath is as follows: Cobalt sulphate - 30g/1 Sodium sulphate - 30g/1 Dimethylamine borane - 4.5g/1 Sodium succinate - 10.9g/1.

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Electroless Cobalt (Boron) Bath

An electroless bath has been developed for depositing cobalt-boron alloy which serves as a gold barrier, as opposed to nickel-phosphorous alloy commonly used on chip pad sites in semiconductor module fabrication. Also, the cobalt boron alloy constitutes a higher melting point alloy than a nickel- phosphorous alloy deposited from a hypophosphite-based bath. An illustrative formulation of the electroless bath is as follows: Cobalt sulphate - 30g/1 Sodium sulphate - 30g/1 Dimethylamine borane - 4.5g/1 Sodium succinate - 10.9g/1.

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