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Mechanical Wafer Pickup

IP.com Disclosure Number: IPCOM000080967D
Original Publication Date: 1974-Mar-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Gardiner, GG: AUTHOR [+3]

Abstract

Numerous techniques have been employed for picking up semiconductor wafers and holding them without motion, while air or other fluid media is applied to the exposed surface of the wafer. This proposal illustrates an extremely simple and yet economical and reliable wafer pickup.

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Mechanical Wafer Pickup

Numerous techniques have been employed for picking up semiconductor wafers and holding them without motion, while air or other fluid media is applied to the exposed surface of the wafer. This proposal illustrates an extremely simple and yet economical and reliable wafer pickup.

In the drawing the wafer pickup 10 includes a substantially cylindrical two- piece molding 11 and 12 which may be mated together in any convenient manner. The material may be a plastic as long as it is somewhat resilient. The lower portion 11 of the cylinder is provided with longitudinally extending, spaced apart slots 13 and 14 which form flaps 15 intermediate the slots. The flaps 15 are secured, in the present instance, at their upper end 16 to form a hinge for the flaps. The lower portion of the flaps may be provided with an inturned lip portion 17 to engage beneath, for example, a semiconductor wafer in a manner which will be described subsequently.

An actuator 18, which may be an air actuator, a solenoid, etc., is mounted on the upper portion 12 of the cylinder, and includes a shaft wafer pick-up device 10. The shaft is coupled to radiantly extending fingers 19 which are hingedly mounted on the extremity of the shaft 18a. The fingers 19 are connected to the lower portion 15A of the flaps 15 whereby, upon reciprocation of the shaft 18A, the flaps tend to move in and out (depending upon the direction of the stroke of the shaft) effecting a lifting action by the l...