Browse Prior Art Database

Minienvironmental Enclosure

IP.com Disclosure Number: IPCOM000080969D
Original Publication Date: 1974-Mar-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 50K

Publishing Venue

IBM

Related People

Dipressi, TJ: AUTHOR [+2]

Abstract

In many semiconductor manufacturing facilities clean air (Class 100 or better) must be provided in large quantities, either on the room level or in the so-called "clean air hood" environment. Large amounts of energy are required to move and clean the large quantity of air required in either type installation. The proposed minienvironmental enclosure 10 illustrated includes a cover 11 having a closed upper end 12 and an open lower end 13. adjacent to the lower open end 13 is a foraminous exhaust tube 14 which extends therearound. The tube 14 is in fluid communication with an exhaust (positively driven) port 15, which passes between an intermediate wall 16 and the interior of the cover 11.

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Minienvironmental Enclosure

In many semiconductor manufacturing facilities clean air (Class 100 or better) must be provided in large quantities, either on the room level or in the so- called "clean air hood" environment. Large amounts of energy are required to move and clean the large quantity of air required in either type installation. The proposed minienvironmental enclosure 10 illustrated includes a cover 11 having a closed upper end 12 and an open lower end 13. adjacent to the lower open end 13 is a foraminous exhaust tube 14 which extends therearound. The tube 14 is in fluid communication with an exhaust (positively driven) port 15, which passes between an intermediate wall 16 and the interior of the cover 11. Spaced inwardly of the upper wall or closed end 12 of the enclosure is a screen 22 which forms a positive pressure, clean air supply plenum chamber 17, in fluid communication with a supply port 18.

One side of the enclosure 10 is connected to a wafer carrier arm 19 by a flexible cover 20, which prevents entry of contaminating external air while permitting motion of the carrier arm 19 in the enclosure. A wafer 21, held by the carrier arm 19, therefore may be moved in the enclosure 10 without movement of the enclosure. Additionally, assuming that the cover 11 is dimensioned properly, it may form in conjunction with etch baths, cleaning baths, etc., a seal which will permit, through the exhaust tubing 14, exhausting of contaminating fumes from such a bat...