Browse Prior Art Database

Processing Metal Lines on Glass Using a Peel Off Process

IP.com Disclosure Number: IPCOM000081067D
Original Publication Date: 1974-Mar-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Burghardt, RW: AUTHOR

Abstract

This method enhances the adhesion of a commercially available photoresist to a glass panel.

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Processing Metal Lines on Glass Using a Peel Off Process

This method enhances the adhesion of a commercially available photoresist to a glass panel.

In the making of metal lines on a glass panel, one of the steps requires the adhesion of a thin layer of photoresist, i.e., AZ1350* to a glass layer. In general such photoresist does not adhere too well to the glass. In the present case, an adhesion layer, i.e. SILICAFILM** (SiO(2)) is employed as an intermediary film between the glass and the photoresist. As seen in Fig. 1, a thin coating (approx. 2000 Angstroms) 2 of SILICAFILM is spun onto a glass substrate 4 and baked at 200 degrees C. for 15 minutes.

As seen in Fig. 2, a film of photoresist 6 is applied to the adhesion-promoting layer 4 and baked at 85 degrees C. for about 15 minutes prior to exposing and processing those regions 8 which will receive a subsequent layer of metal. The next step (see Fig. 3) consists in etching all exposed regions with hydrofluoric acid for about one minute to remove the SiO(2) and 0.5 microns of glass. A 0.5 micron layer of metal 10 is deposited, as seen in Fig. 4, over all surfaces. After metallization is complete, the entire assembly is placed in acetone, the latter dissolving the photoresist layer and the metal above it, leaving the SiO(2) film, as seen in Fig. 5.

The final steps, shown in Fig. 6, comprise placing the glass panel in buffered hydrofluoric acid for about 5-10 seconds to remove the SILICAFILM layer and washing the...