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Fixture for Fabricating Complex Substrate Design from Green Sheet Ceramics

IP.com Disclosure Number: IPCOM000081116D
Original Publication Date: 1974-Apr-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 23K

Publishing Venue

IBM

Related People

Phillips, GC: AUTHOR

Abstract

This is a fixture and method for fabricating complex ceramic substrates such as are used in the packaging of wafer devices.

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Fixture for Fabricating Complex Substrate Design from Green Sheet Ceramics

This is a fixture and method for fabricating complex ceramic substrates such as are used in the packaging of wafer devices.

A profile of the substrate 10 is illustrated in the drawing having a predetermined overall diameter capable of accommodating a metalized recess, adapted to accept wafer devices in the 3 to 3-1/2 inch diameter range. To insure a uniform pressure during the lamination of the recessed and metalized green sheets of ceramic to form substrate 10, it is necessary to use a contoured laminating fixture 11 with projections that coincide with the recesses in the ceramic substrate 10 and a cap 12.

Standard laminating temperatures and pressures are used, which in the preferred method utilizes a temperature of approximately 200 degrees F applied to the fixture 11 and cap 12 for an approximate 2 minute period at approximately 7 tons of pressure, which is then followed by an approximate 15 minute pressure period at approximately 25 tons. After the substrate 10 has been laminated, the outside diameter is trimmed to the desired dimension utilizing a lathe.

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