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Via Hole Metal Paste Deposition

IP.com Disclosure Number: IPCOM000081117D
Original Publication Date: 1974-Apr-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Melvin, GE: AUTHOR

Abstract

An etched molybdenum mask is generally used in the process of filling vias and screen lines on each layer of a multilayer ceramic substrate. An alternative technique is done by bonding a 0.001" foil to the ceramic blank and perform the required hole punching (mechanical) on the laminate (0.008" ceramic 0.001" foil). The foil will then serve as a mask to allow paste to fill all punched vias; thus eliminating the need for a molybdenum mask. The foil could also serve as a carrier for the ceramic, to increase its dimensional stability and strength for automated handling processing.

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Via Hole Metal Paste Deposition

An etched molybdenum mask is generally used in the process of filling vias and screen lines on each layer of a multilayer ceramic substrate. An alternative technique is done by bonding a 0.001" foil to the ceramic blank and perform the required hole punching (mechanical) on the laminate (0.008" ceramic 0.001" foil). The foil will then serve as a mask to allow paste to fill all punched vias; thus eliminating the need for a molybdenum mask. The foil could also serve as a carrier for the ceramic, to increase its dimensional stability and strength for automated handling processing.

If a molybdenum mask is required for strength reasons with mechanical punching; the foil mask will serve to relax the hole diameter's tolerance required in the molybdenum mask and would enable a general via mask to be fabricated, with all possible hole locations appearing in the molybdenum mask. The foil mask would then select vias to be filled with paste. This would eliminate numerous types of molybdenum masks for a given package design.

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