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Water Soluble Solder Resist

IP.com Disclosure Number: IPCOM000081142D
Original Publication Date: 1973-Jul-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Peters, HG: AUTHOR [+2]

Abstract

During the production of electronic assemblies, it is frequently desired to prevent certain holes and lands from becoming coated with solder during the soldering process.

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This is the abbreviated version, containing approximately 100% of the total text.

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Water Soluble Solder Resist

During the production of electronic assemblies, it is frequently desired to prevent certain holes and lands from becoming coated with solder during the soldering process.

Therefore, in order to prevent the adherence of molten solder, a removable maskant or solder resist is usually applied.

The water soluble solder resist comprises by weight, 4 to 24% of an alkali metal silicate, e.g., sodium silicate, 5% to 10% of a humectant, e.g., glycerine based material as glycerol or glycols, and water.

In addition, there may be optionally added 0.03% to 0.3% by weight of a corrosion-inhibitor, e.g., a fluorocarbon compound, and 0.12% to 0.6% by weight of a tinting material, e.g., a xanthene dyestuff.

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