Browse Prior Art Database

In Line Process Monitor for Determining Undercut in Multilayer Metallurgy

IP.com Disclosure Number: IPCOM000081150D
Original Publication Date: 1974-Apr-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Fritz, RA: AUTHOR [+4]

Abstract

In the drawing, an in-line process monitor is depicted that will permit an operator to visually determine the degree of undercut incurred during the etching of multilayer metallurgy.

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In Line Process Monitor for Determining Undercut in Multilayer Metallurgy

In the drawing, an in-line process monitor is depicted that will permit an operator to visually determine the degree of undercut incurred during the etching of multilayer metallurgy.

A needle-shaped test target is incorporated in noncritical or nonactive areas of the photomask. This image will then be reproduced on sensitized product substrates, as represented by photoresist test image 1. As the metals are etched, one layer at a time, some degree of lateral attrition may be expected, but under normal conditions, this should not exceed the thickness of the individual metal layer. Microscopic examination of this etched image will reveal a close approximation to the resist image.

A substrate 2 that has undergone excessive lateral etching will appear significantly different than a normally etched substrate 3 when viewed microscopically. The top layer, chrome, will curl or fracture exposing the sublayers of metal.

This technique affords a nondestructive visual in-line monitor for determining undercut.

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