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Browse Prior Art Database

Metallizing Multilayer Ceramic Top and Bottom Side

IP.com Disclosure Number: IPCOM000081158D
Original Publication Date: 1974-Apr-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 25K

Publishing Venue

IBM

Related People

Haddad, MC: AUTHOR

Abstract

Various metals can be plated upon fired glass fritted noble metal paste conductors Which provide the substrate with the proper metallurgy, for performing the functional requirements of sites for semiconductor chip joining pin brazing, and so forth. The metallurgy can then withstand corrosion in most hostile environments.

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Metallizing Multilayer Ceramic Top and Bottom Side

Various metals can be plated upon fired glass fritted noble metal paste conductors Which provide the substrate with the proper metallurgy, for performing the functional requirements of sites for semiconductor chip joining pin brazing, and so forth. The metallurgy can then withstand corrosion in most hostile environments.

The process starts in Fig. 1 with a substrate 1 having thereon conductor lines
2. In Fig. 2 a metal plating layer 3 which may be, for example, palladium of a thickness of 1 to 25 microns is deposited onto the conductor lines 2. The structure of Fig. 2 is then heated to an appropriate temperature to partially diffuse the palladium coating 3 into the conductor line 1. The surface of the plated layer is then burnished or polished. Another metal layer 4, which may be gold having a thickness of from about 7 to 400 microinches is then plated thereover. The resulting structure is shown in Fig. 3.

Other metal layers can be applied to the fired glass fritted paste conductors. Nickel, palladium and gold and palladium, nickel, gold are two appropriate combinations of metals. Cobalt or an alloy of cobalt and nickel can be substituted for nickel in the examples.

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