Browse Prior Art Database

Die Bonder

IP.com Disclosure Number: IPCOM000081163D
Original Publication Date: 1974-Apr-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Masson, JE: AUTHOR [+2]

Abstract

Die bonders currently used in the semiconductor industry generally involves the soldering (or brazing) of a semiconductor silicon die or chips to a package substrate. Gold plated ceramic substrates are generally used with an intermediate preform which, after appropriate heating, will provide an Au-Si eutectic alloy with the silicon chip base.

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Die Bonder

Die bonders currently used in the semiconductor industry generally involves the soldering (or brazing) of a semiconductor silicon die or chips to a package substrate. Gold plated ceramic substrates are generally used with an intermediate preform which, after appropriate heating, will provide an Au-Si eutectic alloy with the silicon chip base.

The equipment 10 basically comprises: a substrate loader 11, a preheating section 12 and an oven 13 fixed on a main support 14. The control unit and actuating servomotors are not represented. Close to the chip bank 15 is a chip insert unit 16 having an appropriate recess 17 for the chip lodgement and a gold preform container 18.

A controlled pneumatic arm 19 has two vacuum tips: the preform vacuum pickup 20 and the chip vacuum pickup collet 21. This arm can only move up and down along the vertical axis. After completion of the soldering operation, chip bonded substrates are evacuated along rails 22.

In the following steps for the chip bonding operation, substrates are manually or automatically located (in this last case) to a prepositioning system 11, and they pass through the preheating section 12 and oven (400 degrees) 13 before chip and preform positioning.

Chips are transferred by hand from the chip bank 15 to the chip insert unit 16. With pneumatic arm 19 which supports the pickup collet 21 and the pickup tip 20 being in the pickup position (Fig. A), a chip and a preform are simultaneously picked up. The arm...