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Non Lead Dielectric Glass Composition

IP.com Disclosure Number: IPCOM000081170D
Original Publication Date: 1974-Apr-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Foster, BJ: AUTHOR [+3]

Abstract

The following is a non-lead dielectric glass capable of being fired substantially bubble-free at 600 degrees C in a reducing atmosphere. Per cent by weight SiO(2) 10 B(2)O(3) 50 Na(2)O 10 BaO 5 Al(2)O(3) 20 TiO(2) 5 Thermal expansion: 81 x 10/-7//degrees C Softening temperature: 577 degrees C Firing temperature: 600 degrees C Dielectric constant: 6.

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Non Lead Dielectric Glass Composition

The following is a non-lead dielectric glass capable of being fired substantially bubble-free at 600 degrees C in a reducing atmosphere. Per cent by weight

SiO(2) 10

B(2)O(3) 50

Na(2)O 10

BaO 5

Al(2)O(3) 20

TiO(2) 5

Thermal expansion: 81 x 10/-7//degrees C

Softening temperature: 577 degrees C

Firing temperature: 600 degrees C

Dielectric constant: 6.

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