Browse Prior Art Database

Non Lead Dielectric Glass Composition

IP.com Disclosure Number: IPCOM000081171D
Original Publication Date: 1974-Apr-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Foster, BJ: AUTHOR [+3]

Abstract

A non-lead glass dielectric of the following composition and properties capable of withstanding sealing temperatures in excess of 490 degrees C can be fired into substantially bubble-free films at 600 degrees C. Per cent by weight ZnO 40 B(2)O(3) 40 K(2)O 10 Al(2)O(3) 5 SiO(2) 5 Thermal expansion coefficient: 77 x 10/-7//degrees C Softening temperature: 583 degrees C Firing temperature: 600 degrees C.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Non Lead Dielectric Glass Composition

A non-lead glass dielectric of the following composition and properties capable of withstanding sealing temperatures in excess of 490 degrees C can be fired into substantially bubble-free films at 600 degrees C. Per cent by weight ZnO 40 B(2)O(3) 40 K(2)O 10 Al(2)O(3) 5 SiO(2) 5 Thermal expansion coefficient: 77 x 10/-7//degrees C Softening temperature: 583 degrees C Firing temperature: 600 degrees C.

1