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Weightless Probe for Chip Picking

IP.com Disclosure Number: IPCOM000081179D
Original Publication Date: 1974-Apr-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Thomson, WG: AUTHOR

Abstract

This is a vacuum operated probe for engaging semiconductor chips with little to no weight or engaging force. The probe is counterbalanced to eliminate any force before contact is made with the chip.

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Weightless Probe for Chip Picking

This is a vacuum operated probe for engaging semiconductor chips with little to no weight or engaging force. The probe is counterbalanced to eliminate any force before contact is made with the chip.

An aperture 22 extends through the head of probe 10, terminating at aperture 31 that intersects 22 in the undercut portion of shaft 16 which is guided by cylinder 18. When the undercut section of shaft 16 aligns with passages 24 and 26, a vacuum source at the extreme right end of passage 24 draws a vacuum through passageways 31, 22 and 26.

When the element 30 is in a position to close passageway 24, the vacuum locks the device 14 and element 28 in place. Element 28 closes the vacuum circuit along with the device 14 and element 30.

To release the device 14 and allow the probe 10 to descend element 30 is moved so as to uncover passage 24, allowing atmosphere or air pressure to overcome the vacuum lock.

A minimum force on the top surface or the chip 14 is achieved by counterbalancing element 28 on the nonprobe side of the pivot 32. The probe 10 is in the extended position when the unit is brought in contact with the device 14 to be picked. After the probe 12 is in contact with the device 14, further motion of the vacuum assembly 20 causes the probe 10 to retract into the vacuum assembly until the condition described above is initiated.

To deposit the device 14 the assembly 20 is brought into position, aligning the device at the new posit...