Browse Prior Art Database

Computer Operated Laser Dicing Apparatus

IP.com Disclosure Number: IPCOM000081186D
Original Publication Date: 1974-Apr-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Bonar, RG: AUTHOR [+3]

Abstract

An IBM system 7 computer is used to control laser apparatus to extract a defined area from a semiconductor wafer. The computer is operated in an interrupt driven mode to service the laser dicer on demand. Once the laser dicer operation is initiated the computer can perform concurrent tasks. Programming for the computer permits dicing different wafers. Uniform cutting of wafers is insured by stabilizing the laser dicing mechanical table movement to a known speed before the laser beam is switched `on'.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 53% of the total text.

Page 1 of 2

Computer Operated Laser Dicing Apparatus

An IBM system 7 computer is used to control laser apparatus to extract a defined area from a semiconductor wafer. The computer is operated in an interrupt driven mode to service the laser dicer on demand. Once the laser dicer operation is initiated the computer can perform concurrent tasks. Programming for the computer permits dicing different wafers. Uniform cutting of wafers is insured by stabilizing the laser dicing mechanical table movement to a known speed before the laser beam is switched `on'.

Prior to dicing, device test results are logged and identified to each device location in a wafer 12. Computer analysis determines the wafer 12 areas to be cut out and a dicing table 10 is generated, as shown in Fig. 1. The device locations from test and the dicing table 10 coordinate entries are keyed to a reference point on the wafer I2, to enable the laser apparatus to find the correct area for extraction. Only specific areas are cut out of the wafer leaving the remainder in an uncut condition. The dicing table 10 controls the movement of the laser apparatus 14. The table format consists of sequential coordinate information in three command words representing "x address", "y address" and "control". The control word is a computer output word to the laser dicer which commands START/STOP in x and y directions; laser movement rate; direction and TURN ON/OFF.

Fig. 2 shows the movement of the laser in extracting an area 16 from a...