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Water Soluble Solder Mask

IP.com Disclosure Number: IPCOM000081300D
Original Publication Date: 1974-May-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Evans, GL: AUTHOR [+4]

Abstract

A water soluble solder mask that can be applied by silk-screening techniques, has the following general formulation:. Gum arabic (acacia gum) 25-60% by wt. Ethylene glycol 1-15% by wt. Potassium chloride (KCl) 0.2-0.5% by wt. Water balance.

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Water Soluble Solder Mask

A water soluble solder mask that can be applied by silk-screening techniques, has the following general formulation:. Gum arabic (acacia gum) 25-60% by wt.

Ethylene glycol 1-15% by wt.

Potassium chloride (KCl) 0.2-0.5% by wt.

Water balance.

One of these formulations, which proved very satisfactory, comprises

Gum arabic 60% by wt.

Ethylene glycol 10% by wt. (total H(2)O + gum)

Potassium chloride 0.3% by wt.

Water balance.

Additional constituents may, if desired, be added to the mask for special purposes; e.g., dyes to improve inspection techniques; fungicides to prevent microbiological growths; and antifoam or anticorrosion agents.

The above formulations exhibit little or no stringiness or tackiness, dry rapidly, are screenable for full board or circuit line coverage, adhere without chipping or flaking, and leave no residue after washing. It will be understood that viscosity can be adjusted, as desired, to suit a particular application.

The potassium chloride transposes the gum arabic of whatever Source and age into a perfectly functional solder mask.

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