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Simultaneous Polymeric Layer and Metallization Layer Etch

IP.com Disclosure Number: IPCOM000081312D
Original Publication Date: 1974-May-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Rasile, J: AUTHOR [+2]

Abstract

In the fabrication of integrated circuit modules, after the ceramic substrate has been metallized, e.g., chrome-copper-chrome, to produce module personality and the photolithographic material removed, the module is coated with a polymeric material, e.g., polyamide-imide, using any suitable method such as spraying, spinning, roller-coating, and the like. Coating is between 300 and 500 microinches thickness and partially cured at the appropriate temperature.

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Simultaneous Polymeric Layer and Metallization Layer Etch

In the fabrication of integrated circuit modules, after the ceramic substrate has been metallized, e.g., chrome-copper-chrome, to produce module personality and the photolithographic material removed, the module is coated with a polymeric material, e.g., polyamide-imide, using any suitable method such as spraying, spinning, roller-coating, and the like. Coating is between 300 and 500 microinches thickness and partially cured at the appropriate temperature.

A photoresist is applied and developed to expose chip sites and pin interconnection sites. Upon etching with KMnO(4)/NaOH or permanganate with developer, the exposed polymeric material and the chrome are removed to expose copper at chip sites. Resist is removed and the polymer fully cured or cured subsequently. The module is pinned, tinned and chip joined.

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