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Browse Prior Art Database

Module Tinning Fixture

IP.com Disclosure Number: IPCOM000081318D
Original Publication Date: 1974-May-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Goldmann, LS: AUTHOR

Abstract

Fig. A shows a pressed ceramic fixture 1 which is capable of holding a multiplicity of ceramic modules for tinning of metal conductors on the module. Cavities 2 are shown in the ceramic fixture for holding the modules.

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Module Tinning Fixture

Fig. A shows a pressed ceramic fixture 1 which is capable of holding a multiplicity of ceramic modules for tinning of metal conductors on the module. Cavities 2 are shown in the ceramic fixture for holding the modules.

Fig. B shows a module 3 positioned in one of the cavities 2 in the ceramic fixture 1. The module is held by a spring clamp 4 within the cavity. The module is typically a ceramic piece, which has on its surface metal lines or pads 5 and semiconductor chip joining pads
6. The metallic lines or pads on the module are to be tinned or solder coated. The fixture 1 has solder cups 7 which are slightly larger than the metallic line or pads 5 at the surface of the module.

Similarly, the smaller solder cups 8 are slightly larger than the semiconductor chip joining pads 6 at the surface of the module. This is to allow for registration tolerance.

A ceramic blank, not shown, can be inserted in the cavity 9 if the chip joining pads 6 are to be left untinned, or if different solders are required for the chip joining pads 6 and the lines or pads 5. The space shown between the module 3 and the fixture 1 is shown only for clarity. The module 3 is actually flush against the fixture 1.

The module loaded fixture 1 is inverted for tinning or solder coating. The fixture is then immersed in a solder bath and withdrawn. The shape of the solder cups 7 and 8 holds solder in the cup portion of the fixture, during the withdrawal of the fixture 1 from the...