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Selective Lead and Glass Etchant

IP.com Disclosure Number: IPCOM000081348D
Original Publication Date: 1974-May-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Gardner, TR: AUTHOR [+4]

Abstract

In fabricating a gaseous discharge display device using glass technology, a soda lime silica glass is used as a substrate, a conductor array is formed on the substrate, and a high-lead glass dielectric film formed over the conductors to isolate the conductors from direct contact with the gas. Two plates or substrates are then positioned so that the conductor arrays are substantially orthogonal to each other, and the plates hermetically sealed during an oven cycle prior to filling the display device with the appropriate gas.

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Selective Lead and Glass Etchant

In fabricating a gaseous discharge display device using glass technology, a soda lime silica glass is used as a substrate, a conductor array is formed on the substrate, and a high-lead glass dielectric film formed over the conductors to isolate the conductors from direct contact with the gas. Two plates or substrates are then positioned so that the conductor arrays are substantially orthogonal to each other, and the plates hermetically sealed during an oven cycle prior to filling the display device with the appropriate gas.

Since the conductor arrays are brought to termination pads on the associated substrate, the dielectric glass is formed over the entire conductor array to protect the conductors during the high-temperature sealing cycle. When the plates are sealed, it is necessary to remove the dielectric film from the conductor array at the termination pads, so they will be exposed for connection with the driving source.

A selective etchant is required to remove the high-lead dielectric glass from the silica glass, without attacking the silica glass or the seal glass. One etchant for removing the high-lead dielectric glass from the soda lime glass is a dilute perchloric acid solution, which removes the lead from the dielectric glass causing the glass layer to collapse. The remaining powder may then be brushed or washed away. However, when a lower lead content glass dielectric is used, the collapse of the glass structure by perc...