Browse Prior Art Database

Hydrodynamic Blade Guide for Thin Circular Saws

IP.com Disclosure Number: IPCOM000081392D
Original Publication Date: 1974-May-01
Included in the Prior Art Database: 2005-Feb-27
Document File: 2 page(s) / 27K

Publishing Venue

IBM

Related People

Miller, J: AUTHOR [+2]

Abstract

During the manufacture of semiconductor devices, a wafer having many thousands of devices formed in it must be diced into a number of individual chips. The size of the individual chips will depend upon the complexity of the electrical circuit formed in it, but on the wafer, the chip areas are separated from one another by a kerf region.

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Hydrodynamic Blade Guide for Thin Circular Saws

During the manufacture of semiconductor devices, a wafer having many thousands of devices formed in it must be diced into a number of individual chips. The size of the individual chips will depend upon the complexity of the electrical circuit formed in it, but on the wafer, the chip areas are separated from one another by a kerf region.

Conventionally, the wafer is diced by sawing through the kerf area. By reducing the kerf area on the semiconductor wafer, yield can be increased due to the decreased wafer area required for a particular number of chips. The kerf area can be minimized by decreasing the width of the saw cut and#or by decreasing the edge damage. Similar considerations can also apply when ceramic substrates, for example of barium titanate, are sawn during the manufacture of components using ceramic parts.

In the drawings, saw disk 1, typically a steel disk of 150 mm diameter coated with 15 to 30 mu m diamond grit, is used to dice wafer 2 into individual chips 3. The saw disk 1 is positioned within blade guide 4 with a small clearance, typically
0.025 mm, between the disk 1 and cheeks 5 of blade guide 4. Pipes 6 are used to inject cutting coolant liquid, for example water, into the clearance between disk 1 and cheeks 5. When disk 1 is rotated in the direction of the arrow, coolant liquid will be entrained within the clearance by hydrodynamic action and improved cooling and lubrication results.

If the clea...