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Multipath Solder Connection for Multipath Pins

IP.com Disclosure Number: IPCOM000081458D
Original Publication Date: 1974-Jun-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Ecker, ME: AUTHOR

Abstract

This structure provides a multiple solder connection between a circuit supporting structure and a multicontact pin, while maintaining a multiplicity of distinct electrical paths.

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Multipath Solder Connection for Multipath Pins

This structure provides a multiple solder connection between a circuit supporting structure and a multicontact pin, while maintaining a multiplicity of distinct electrical paths.

As illustrated in Fig. 1, each pin blank comprises beryllium-copper 4 joined to an aluminum segment 3. The pin blanks are then shaped to the configuration shown in Fig. 2. By appropriate masking and chemical processing, a 1 - 2 mil hard anodic coating is formed on the surface of segment 3 of the formed pin 4 prior to connection with other pins.

As shown in Fig. 2, four pins are nested and locked in this position by locking ring 10. The pins are brazed to the bottom of module 2 and inserted in a printed- circuit card 5 through a via hole having peripheral contacts 7. Solder joint 6 ohmically connects each of the four pins to contact 7.

Fig. 3 is a top cross-sectional view of a cluster of four elements. Each pin 4 is ohmically connected to an associated printed-circuit land 12. Anodic barriers 3 and air gaps 15 serve to separate each of the pins 4 from each other.

The chief advantage of this structure is the reduced need for programmed via holes, because one hole serves four individual pins. Another important feature is the ease of engineering changes. Repairs are easily accomplished by reflowing the solder 6 in a hole and inserting the tinned end of a correction yellow wire. The reflow of a particular solder contact in a hole does not disturb...