Browse Prior Art Database

Test Chamber with Seal and Boot

IP.com Disclosure Number: IPCOM000081459D
Original Publication Date: 1974-Jun-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Bruder, SI: AUTHOR [+3]

Abstract

The test chamber with seal and boot illustrated in the drawing is utilized to test substrates which are populated with integrated circuit chips, the testing to take place in a liquid coolant environment to prevent device burnout, and to minimize the possibility of contaminating the product and the cooling liquid.

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Test Chamber with Seal and Boot

The test chamber with seal and boot illustrated in the drawing is utilized to test substrates which are populated with integrated circuit chips, the testing to take place in a liquid coolant environment to prevent device burnout, and to minimize the possibility of contaminating the product and the cooling liquid.

Referring to the sketch, an integrated circuit chip populated substrate 1 is brazed or otherwise connected to a dish-shaped flange assembly 2, the flange being placed into a contactor or receiver 3. The pins on the substrate are connected into suitable sockets or connectors within the receiver 3. The test chamber 4 is moved into position so that a seal 5 engages the flange of the dish
2.

The test chamber 4 is then filled with a cooling liquid through filler tube 6 and upon the cooling liquid reaching a sensor 7, the filling is stopped. The product is powered through the contactor pins by the connectors in the receiver 3. Probes 8 move into engagement with various parts of the circuitry in the integrated circuit chips or connectors thereto, for determining electrical parameters. As shown, the probes 8 are sealed at 9 to a flexible boot 10, the boot being compatible with the particular cooling liquid being utilized within the chamber, while permitting freedom of movement for the probes 8 within the test chamber.

Upon completion of the test, the drain 11 is opened and the cooling liquid is removed. Upon completion of removal...