Browse Prior Art Database

Aluminum and Lead Tin Terminals for Integrated Circuits

IP.com Disclosure Number: IPCOM000081468D
Original Publication Date: 1974-Jun-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 30K

Publishing Venue

IBM

Related People

Aubin, RJ: AUTHOR [+2]

Abstract

In the drawing, an integrated circuit device is depicted. The device has terminals, or pads, each comprised of a lead-tin portion and an aluminum portion. Soldered connections may be made to the lead-tin portion, whereas for thermal compression or ultrasonic bonding, the aluminum portion is employed.

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Aluminum and Lead Tin Terminals for Integrated Circuits

In the drawing, an integrated circuit device is depicted. The device has terminals, or pads, each comprised of a lead-tin portion and an aluminum portion. Soldered connections may be made to the lead-tin portion, whereas for thermal compression or ultrasonic bonding, the aluminum portion is employed.

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