Browse Prior Art Database

Use of Direct Edge Seals in Gas Panels with Flowed Out Dielectric

IP.com Disclosure Number: IPCOM000081537D
Original Publication Date: 1974-Jun-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Reisman: AUTHOR [+4]

Abstract

One of the major problems encountered in gas panel fabrication is obtaining a hermetic seal. A variety of leak paths in the gas panel is possible and one of these is between the metal lines and the dielectric layer, and finally into the active region by way of a defect in the dielectric layer. Described is a way to avoid this leak path, by removing the dielectric layer in the seal area and effecting a seal directly to the substrate.

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Use of Direct Edge Seals in Gas Panels with Flowed Out Dielectric

One of the major problems encountered in gas panel fabrication is obtaining a hermetic seal. A variety of leak paths in the gas panel is possible and one of these is between the metal lines and the dielectric layer, and finally into the active region by way of a defect in the dielectric layer. Described is a way to avoid this leak path, by removing the dielectric layer in the seal area and effecting a seal directly to the substrate.

In the case of the evaporated dielectric layer, a mesk can be used to keep the dielectric in a central area. However, in the case of the reflow dielectric, the metal lines must be protected during the firing of the glass layer in air (the reflow of the glass must be done in air). In order to implement the direct seal method to gas panels in which the reflow process is used, the following five-step process is proposed.
1. Starting with a panel part which has a metal-line pattern and

reflowed dielectric over the entire surface, protect the center

portion of the dielectric with a black-wax mask (or any suitable

etchant mask) as shown in Fig. 1.
2. Etch exposed dielectric 3-4 minutes using 15% perchloric

acid - HF (25:1).
3. Etch exposed dielectric 3-4 minutes using trichlorethylene

and

then rinse with acetone and water. The dashed area, in Fig. 2

shows the remaining dielectric glass.
4. Using mask, deposit MgO over remaining dielectric, as shown

in

Fig. 3.
5. Seal panel pa...