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Polyimide Epoxy Flame Retardant Resin Blend

IP.com Disclosure Number: IPCOM000081594D
Original Publication Date: 1974-Jul-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Saunders, TF: AUTHOR [+2]

Abstract

This is a high-performance, flame-retardant resin formulation for reinforced printed circuits and similar panels.

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This is the abbreviated version, containing approximately 100% of the total text.

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Polyimide Epoxy Flame Retardant Resin Blend

This is a high-performance, flame-retardant resin formulation for reinforced printed circuits and similar panels.

This formulation is achieved by blending calculated stoichiometrically equivalent quantities of KERIMID 601* polyimide resin powder with a suitable epoxy material, such as the diglycidyl ether of tetrabromobisphenol A and a stoichiometrically balanced quantity of 4, 4'-diaminodiphenyl ether.

The brominated epoxy imparts flame retardancy, whereas the ether imparts flexibility. The epoxy/ether stoichiometric blend constitutes the minor portion of the blend, the KERIMID 601 resin being the primary ingredient. *Trade name of Rhodia Inc. for its stoichiometric blend of the bismaleimide of methylene dianiline plus methylene dianiline.

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