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Printed Circuit Board Manufacture

IP.com Disclosure Number: IPCOM000081596D
Original Publication Date: 1974-Jul-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Angelo, RW: AUTHOR [+2]

Abstract

Bond strength of electroless metal bonded to an organic substrate is enhanced by application of a thin layer of copolymer to copper or aluminum foil.

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Printed Circuit Board Manufacture

Bond strength of electroless metal bonded to an organic substrate is enhanced by application of a thin layer of copolymer to copper or aluminum foil.

Copper or aluminum foil, pretreated for adhesion, is coated with a solution of a copolymer of vinylidene fluoride and hexafluoropropylene (marketed by E. I. du Pont de Nemours Co. under the trade name VITON, and by Minnesota Mining & Manufacturing Co. under the trade name FLUOREL) to provide a thin (e.g.,
0.0002 - 0.0005") layer of copolymer thereon. The foil is then air dried at room temperature.

If both sides of the foil were coated (e.g., by dip coating), then the back side of the foil must be cleaned with a suitable solvent, such as methyl chloride; otherwise this step may be eliminated.

The foil is then laminated with epoxy prepreg or polyimide to form an organic substrate; whereupon the foil is etched away, leaving a thin coat of the copolymer on the surface of the substrate, with the copolymer treated surface of the foil replicated on the substrate surface. The substrate surface is then palladium seeded and additively plated, resulting in the plated metal being bonded to the substrate with a bond strength of about 8-1/2 lb/in.

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