Browse Prior Art Database

Temperature Measurement of Beam Irradiated Samples

IP.com Disclosure Number: IPCOM000081727D
Original Publication Date: 1974-Jul-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Viswanathan, NS: AUTHOR

Abstract

The heating effects of an electron beam on a substrate used, for example, in the formation of integrated circuits is experimentally measured using a fine wire grid formed in the substrate.

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Temperature Measurement of Beam Irradiated Samples

The heating effects of an electron beam on a substrate used, for example, in the formation of integrated circuits is experimentally measured using a fine wire grid formed in the substrate.

Using an insulating substrate to minimize heat losses to the wafer holder, a fine wire grid is formed on the substrate using photolithographic techniques. Typically a small chip about 250 mils square is fabricated. The wire pattern is formed from high-conductivity metals such as d-band metals and platinum group metals, with dimensions in the order of about 1 micron wide and 0.5 micron thick. The resistance changes in the wire due to the heat from the electron beam are measured either in the AC or DC mode, and the temperature changes are determined from the temperature coefficient of resistance of the metal.

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