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Interface Array Connector System

IP.com Disclosure Number: IPCOM000081739D
Original Publication Date: 1974-Jul-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 27K

Publishing Venue

IBM

Related People

Getten, JR: AUTHOR [+2]

Abstract

This is an area array interconnection system that provides a solder or a liquid metal interface between opposing solder wettable surfaces, which require electrical interconnection. The interface is provided by fabrication and adhesive bonding of two pieces of flexible film 10 and 11, on which copper circuit detail has been produced. The circuit detail on the flexible film sheets 10 and 11 is dependent upon the circuit requirements, and the application use of the printed-circuit board so fabricated. A plurality of solder balls 12 are sandwiched between the two flexible film sheets 10 and 11 directly in line with dimpled "bleed" holes 13.

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Interface Array Connector System

This is an area array interconnection system that provides a solder or a liquid metal interface between opposing solder wettable surfaces, which require electrical interconnection. The interface is provided by fabrication and adhesive bonding of two pieces of flexible film 10 and 11, on which copper circuit detail has been produced. The circuit detail on the flexible film sheets 10 and 11 is dependent upon the circuit requirements, and the application use of the printed- circuit board so fabricated. A plurality of solder balls 12 are sandwiched between the two flexible film sheets 10 and 11 directly in line with dimpled "bleed" holes
13.

In assembly and interconnect operations, the interface 14 is placed between the opposing components 15 and 16 and adequate clamping pressure is then applied. The parts to be joined are raised in temperature above the melting point of the solder 12. The elastic nature of the film 10 and 11 and the pressure applied tends to flatten the interface, thereby forcing the molten or liquid solder 12 through the "bleed" holes 13 wetting the component pads 17 and 18, and in readiness to form the electrical interconnections. Upon removal of the heating and solidification of the solder 12, solder joining columns are produced which are appreciably taller than usually produced by conventional means.

The taller solder column produces three beneficial conditions. First, the potential for a taller solder column per...