Browse Prior Art Database

Grooved Multiwafer Liquid Cooled Package

IP.com Disclosure Number: IPCOM000081755D
Original Publication Date: 1974-Aug-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 28K

Publishing Venue

IBM

Related People

Aimi, B: AUTHOR

Abstract

The drawing illustrates a method and structure for stacking spaced apart semiconductor wafers, such a silicon having an array of devices on each wafer, either integrated thereon or in the form of mounted chips.

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Grooved Multiwafer Liquid Cooled Package

The drawing illustrates a method and structure for stacking spaced apart semiconductor wafers, such a silicon having an array of devices on each wafer, either integrated thereon or in the form of mounted chips.

Wafer body 1 is provided with a series of grooves 2 around the periphery of the wafer. Each groove 2 is provided with a conductive metal composition 3 around the innermost edge of the grooves. The grooves 2 of each individual wafer 1 are connected to each other and supported apart by a wire or rod 4, which acts as an interconnection means as well as stacking supports.

The structure illustrated allows semiconductor wafers 1 to be packaged in a suitable container having a cooling medium therein, thereby allowing the cooling medium to contact all surfaces of each individual wafer 1. Similarly, use of substrates as a mounting or stacking support is eliminated, providing a more simple and less complicated wafer packaging concept.

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