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Spin Test for Solder Reflow Joints

IP.com Disclosure Number: IPCOM000081757D
Original Publication Date: 1974-Aug-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 24K

Publishing Venue

IBM

Related People

Watson, RH: AUTHOR

Abstract

Solder reflow joints may be tested under various centrifugal force and temperature conditions, while simultaneously observing deformation and failure conditions.

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Spin Test for Solder Reflow Joints

Solder reflow joints may be tested under various centrifugal force and temperature conditions, while simultaneously observing deformation and failure conditions.

Referring to the drawing a rotable table 1 is provided having a suitable transparent cover 2. The table 1 has any suitable means for securing semiconductor chips and/or modules 3, having solder reflow joints 4 thereon, to the table. A means 5 for supplying radiant or other heat developing energy to the module or device specimens 3 is provided, in conjunction with a strobe light and observation means 6.

Temperature within the cover 2 is recorded by any suitable means and force calculated in accordance with (1) F=mw/2/r or (2) F=Wpi/2/N/2/r over 900g where N is RPM, W=weight, r=radius, pi=3.1416, g=32.2 ft/sec, F=force, m=mass and w=angular velocity.

The RPM is measurable by any suitable device.

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