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Molded Fins for Heat Transfer

IP.com Disclosure Number: IPCOM000081779D
Original Publication Date: 1974-Aug-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Nuccio, C: AUTHOR

Abstract

The drawing shows a portion of an apparatus for molding a component with closely spaced fins. The apparatus is particularly useful for molding heat transfer devices and it may be used for molding metal or a heat conductive plastic.

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Molded Fins for Heat Transfer

The drawing shows a portion of an apparatus for molding a component with closely spaced fins. The apparatus is particularly useful for molding heat transfer devices and it may be used for molding metal or a heat conductive plastic.

The mold includes a plate 2, and an upper part 3, and a lower part having sections 4 and 5. The upper and lower parts unite with the plate 2 (and a corresponding plate not shown in the drawing) to form a cavity 6. The upper and lower parts join along a line 7. Mold parts 3 and 4 have slots 8 that are shaped according to fins that are to be formed in the molded product. When fins are molded integrally, the minimum thickness of the fins and the minimum spacing between fins is restricted.

With this apparatus the fins 9 are formed separately from a thin sheet of metal or plastic and are located in the slots 8. When the plastic or metal is injected into the mold cavity 6, the fins 9 fuse into an integral structure. In this structure the fins 9 can be made very thin and can be spaced very close together.

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