Browse Prior Art Database

Polymeric Materials for Semiconductor Packaging

IP.com Disclosure Number: IPCOM000081869D
Original Publication Date: 1974-Aug-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 21K

Publishing Venue

IBM

Related People

Raider, SI: AUTHOR [+2]

Abstract

This polymeric-material combination includes additive organic and in-origanic materials that immobilize sodium and other alkali ions that may be present in the device.

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Polymeric Materials for Semiconductor Packaging

This polymeric-material combination includes additive organic and in- origanic materials that immobilize sodium and other alkali ions that may be present in the device.

Polymeric materials have been considered as potential replacements for sputtered quartz as packaging materials, as well as for other packaging applications in semiconductor applications. The cleanest of the usable polymers contains about 10 /12/ mobile sodium ions/cm/2/ which is above the allowable limit particularly in field effect transistor applications.

Polyglycols and polyethers are miscible in a polymer mixture. Sodium or other alkali ions can be immobilized by the well-known capacity of the multidentate ligands to form about the alkali ions, i.e.

The mobility of the alkali ion-ligand complex is greatly reduced in the cured polymer because of its size. The complex is sufficiently stable so that it will not decompose during curing. The alkali ions are thus immobilized in an organic medium by a complexing agent in a manner similar to the phosphosilicate glass in silicon dioxide. The procedure may be generally applied for immobilizing alkali ions in organic or polymeric materials by adding miscible materials which form multidentate ligands about alkali ions. Typical ligand binding sites are oxygen, nitrogen and sulfur. Suggested miscible organic materials include ethylene glycol and dimethoxyethande which can be added to polyimide.

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