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Browse Prior Art Database

Liquid Cooled Electronic Components for Low End Machines

IP.com Disclosure Number: IPCOM000081876D
Original Publication Date: 1974-Aug-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Cunavelis, PJ: AUTHOR [+2]

Abstract

In a situation where large-scale integrated (LSI) modules are not capable of being cooled by forced air, the cooling system proposed can be used which has: a) Low cost. b) Low-pressure force on card (planar or board). c) Minimum amount of piping, cooling hardware. d) Accommodates components/cards - to planar of various heights. e) Flexible to size of boards/planar. f) Flexible to methods of discharging heat by air. g) Sealing to air not critical. h) Easy access for servicing. i) Use of nonvolatile liquid to cool by forced liquid cooling - designed to cool liquid encapsulated LSI modules.

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Liquid Cooled Electronic Components for Low End Machines

In a situation where large-scale integrated (LSI) modules are not capable of being cooled by forced air, the cooling system proposed can be used which has:
a) Low cost.
b) Low-pressure force on card (planar or board).
c) Minimum amount of piping, cooling hardware.
d) Accommodates components/cards - to planar of

various heights.
e) Flexible to size of boards/planar.
f) Flexible to methods of discharging heat by air.
g) Sealing to air not critical.
h) Easy access for servicing.
i) Use of nonvolatile liquid to cool by forced liquid

cooling - designed to cool liquid encapsulated

LSI modules.

The cooling system includes a pan 10 with an electronic card/board as a cover. Fluid is pumped into the pan 10 at either the bottom/sides and directed to the most critical electronic component. Specific apertures/slots 12 are constructed near the top side of the pan to allow fluid to spill over the sides. Depending on the width of the openings 12 at the top of the pan 10, the flow rate, and viscosity of the fluid, the height of the fluid at the spillover is so adjusted that the fluid doesn't exert pressure on the electronic card.

One or more pans 10 are contained within a larger pan 14 (see Fig. 2) which contains the sump 16 for the pump 18. The pump 18 may be contained within this pan or may be external thereto. This external pan 14 may be finned to dissipate heat to the environment or the fluid may be pumped to an externa...