Browse Prior Art Database

Flexible Multilayer Interconnection Board Fabrication

IP.com Disclosure Number: IPCOM000081938D
Original Publication Date: 1974-Sep-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Smith, DL: AUTHOR

Abstract

A flexible multilayer interconnection board (MIB) has a center flexible region, which includes intermediary multilayers of epoxy glass formed on each side of at least one polyimide layer.

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Flexible Multilayer Interconnection Board Fabrication

A flexible multilayer interconnection board (MIB) has a center flexible region, which includes intermediary multilayers of epoxy glass formed on each side of at least one polyimide layer.

Heretofore in the fabrication of such MIBs, after the layers were laminated, the center regions had to be carefully milled within close tolerances to avoid cutting the polyimide layer. The milling was done to remove rigid epoxy glass from both sides of the flexible polyimide region.

In the present system, preregistered precuts are formed in the layers prior to the lamination process. After the lamination process, the milling step is performed substantially on the outer conductive layers adjacent to the precuts, thereby reducing the milling accuracy and tolerances previously required, and thus mitigating the chances of cutting the polyimide layer. Thereafter, the MIB is flexed and the unwanted material removed.

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