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Variable Area Heat Sink Device

IP.com Disclosure Number: IPCOM000081945D
Original Publication Date: 1974-Sep-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 37K

Publishing Venue

IBM

Related People

Connors, PM: AUTHOR

Abstract

This is a heat sink for electronic components and which has an adjustable cooling area. The heat sink comprises a set of concentric metal cylinders 10, 11 and 12 with numerous drilled or punched holes 13 therein. The cylinders may be made from aluminum or copper pipe into which the holes have been drilled, or they may be made from flat stock which has been hole-punched and then formed into a cylinder.

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Variable Area Heat Sink Device

This is a heat sink for electronic components and which has an adjustable cooling area. The heat sink comprises a set of concentric metal cylinders 10, 11 and 12 with numerous drilled or punched holes 13 therein. The cylinders may be made from aluminum or copper pipe into which the holes have been drilled, or they may be made from flat stock which has been hole-punched and then formed into a cylinder.

Alternatively, the heat sink can be rectangular in design to better accommodate rectangular shaped module covers or the like. The metal heat sinks are adjustable so that the surface area exposed to cooling air is increased or decreased, as desired.

The heat sink is attached by bonding to the module cover 14. Bonding to the module cover 14 may be by any appropriate method, such as, brazing, soldering, welding, or by the use of thermally conductive adhesive.

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