Browse Prior Art Database

Wafer Mapping for Chip Picking

IP.com Disclosure Number: IPCOM000081967D
Original Publication Date: 1974-Sep-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Nestler, KR: AUTHOR [+2]

Abstract

A wafer stepper, electronic parameter tester and an X-Y plotter are coupled together as depicted in Fig. 1, to obtain an on-line hard copy pass-fail wafer map. This map may then be used to pick good chips from wafers. A wafer map is depicted in Fig. 2. The system operation is as follows: 1. The binary-coded decimal (BCD) X and Y outputs of the wafer stepper are coupled to two digital-to-analog (D/A) converters, which in turn are coupled to the X and Y inputs of the X-Y plotter. This controls the coordinate movement. 2. The wafer stepper's contacting signals are coupled to the X-Y plotter pen to command when the the record function is to be engaged. 3.

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Wafer Mapping for Chip Picking

A wafer stepper, electronic parameter tester and an X-Y plotter are coupled together as depicted in Fig. 1, to obtain an on-line hard copy pass-fail wafer map. This map may then be used to pick good chips from wafers. A wafer map is depicted in Fig. 2.

The system operation is as follows:
1. The binary-coded decimal (BCD) X and Y outputs of the wafer

stepper are coupled to two

digital-to-analog (D/A) converters, which in

turn are coupled to the X and Y

inputs of the X-Y plotter. This

controls the coordinate movement.
2. The wafer stepper's contacting signals are coupled to the

X-Y plotter pen to command when the

the record function is to be engaged.
3. The electronic parameter tester pass-fail

to information is fed the X and Y D/A converters

so that different symbols can be generated on the

the map, to show pass-fail information (see Fig.

2).
4. Controls are provided on the D/A converters which,

when used in conjunction with the controls

on the X-Y plotter, allows alignment of the coordinate

movement to the wafer map on Fig. 2.

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