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Controlling Interfacial Compositions of Multicomponent Systems

IP.com Disclosure Number: IPCOM000082053D
Original Publication Date: 1974-Sep-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Cuomo, JJ: AUTHOR [+3]

Abstract

In multicomponent sputtering, varying sputtering yields of the materials present a problem. During the sputtering process the target surface layer adjusts in composition, according to the system conditions used and the yield difference of the components making up the target. The process takes place until a steady state is arrived at.

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Controlling Interfacial Compositions of Multicomponent Systems

In multicomponent sputtering, varying sputtering yields of the materials present a problem. During the sputtering process the target surface layer adjusts in composition, according to the system conditions used and the yield difference of the components making up the target. The process takes place until a steady state is arrived at.

Complications to the process take place due to the morphology of the target surface, as well as the presence of multiphase materials where preferential sputtering of grain boundaries occur yielding a gradual drift in target composition. The normal procedure for conditioning a system prior to sputtering is to presputter the target with the samples shuttered and grounded.

Reproducible multicomponent materials, are obtainable when the target voltage for the presputter process is the same as the film deposition process. The process uses a bias presputtering which is identical to the condition for the film deposition. This is achieved by isolating the shutter and producing a profile which is very close to the deposition condition, thereby allowing its bias.

The process provided a film with integrity throughout its growth. The process is of particular value for magnetic bubble domain applications, requiring the preparation of Gd, Co, and Mo alloys having film thickness in the area of 500 to 5000 angstroms film thickness.

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