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Photosensitive Bisdiene Resin Coatings and Dielectrics

IP.com Disclosure Number: IPCOM000082103D
Original Publication Date: 1974-Oct-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 24K

Publishing Venue

IBM

Related People

Boyce, RH: AUTHOR [+3]

Abstract

Bisdiene compositions having the general formula: (Image Omitted) are used in forming photosensitive dielectrics. The cyclopentadiene moieties are the reactive functional groups in these materials, undergoing thermally activated Diels-Alder addition with themselves to produce highly crosslinked thermosets. A peroxide catalyst can be used to catalyze this reaction. Here, these materials are adapted to photosensitive coatings and dielectrics.

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Photosensitive Bisdiene Resin Coatings and Dielectrics

Bisdiene compositions having the general formula:

(Image Omitted)

are used in forming photosensitive dielectrics. The cyclopentadiene moieties are the reactive functional groups in these materials, undergoing thermally activated Diels-Alder addition with themselves to produce highly crosslinked thermosets. A peroxide catalyst can be used to catalyze this reaction. Here, these materials are adapted to photosensitive coatings and dielectrics.

The reactive unsaturation of the cyclopentadiene ring plus any other built-in unsaturation with the R groups, such as acrylic groups, would be susceptible to anthraquinone-initiated photo crosslinking and insolubilization. The resin preparation can be as follows:

(Image Omitted)

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