Browse Prior Art Database

Multilayer Ceramic Kerfless Blanking and Lamination

IP.com Disclosure Number: IPCOM000082139D
Original Publication Date: 1974-Oct-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Manner, H: AUTHOR [+2]

Abstract

This multilayer ceramic manufacturing (MLC) process is based on a multiple-up configuration in various substrate sizes, from via hole forming to the lamination operation. After lamination, the individual substrates are separated in a sawmilling operation called "sizing". Thus the current concept of cavity lamination in multiple-up mode requires three separate and consecutive operations: 1) Blanking of layers into a portable laminating cavity operation which is performed on a blanking press; 2) Insertion of the portable cavity into the laminating press; and, 3) Extraction of the laminate and sizing on a sawmill.

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Multilayer Ceramic Kerfless Blanking and Lamination

This multilayer ceramic manufacturing (MLC) process is based on a multiple-up configuration in various substrate sizes, from via hole forming to the lamination operation. After lamination, the individual substrates are separated in a sawmilling operation called "sizing". Thus the current concept of cavity lamination in multiple-up mode requires three separate and consecutive operations: 1) Blanking of layers into a portable laminating cavity

operation which is performed on a blanking press;

2) Insertion of the portable cavity into the laminating

press; and,

3) Extraction of the laminate and sizing on a sawmill.

The tool shown in Figs. 1 and 2 combines the three steps into a single operation performed in a laminating press. The concept of identical but opposed and implicating punches and die cavities, eliminates the kerf area between units of multiple-up layers.

A 4-up tool is illustrated in exploded form in Fig. 1, wherein there is illustrated the upper platen 3, dowel alignment holes 4, die cavity 5, punches 6, upper cavity plate 7, MLC alignment holes 8, MLC layers 9, layers alignment pins 10, lower cavity plate 11, platens alignment dowels 12, stripper springs 13 and lower platen 14. The sequence of operation is as follows:

1) Align all layers on the lower cavity 11, assemble upper

cavity 7 and upper platen 3 to complete stack; 2) Preheat die;

3) Place stack in laminating press - press operates

through (a) a...