Browse Prior Art Database

Waffled Surface Dicing Pallet

IP.com Disclosure Number: IPCOM000082140D
Original Publication Date: 1974-Oct-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 36K

Publishing Venue

IBM

Related People

Makhijani, MP: AUTHOR [+4]

Abstract

Semiconductor wafers are processed with a plurality of identical regions thereon. At the end of the process, these regions of the wafer are cut apart from one another so that they may be individually used. The cutting of the semiconductor wafer is accomplished after the wafer is adhesively mounted upon a pallet.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Waffled Surface Dicing Pallet

Semiconductor wafers are processed with a plurality of identical regions thereon. At the end of the process, these regions of the wafer are cut apart from one another so that they may be individually used. The cutting of the semiconductor wafer is accomplished after the wafer is adhesively mounted upon a pallet.

It has been found that the illustrated waffled surface, on otherwise conventional dicing pallets, has allowed for more thorough separation of cut or diced chips from the pallet by the resulting channels. The channels allow the flow of a suitable solvent for the adhesive to take place between the wafer and the pallet, in order to dissolve and erode the adhesive.

1

Page 2 of 2

2

[This page contains 2 pictures or other non-text objects]