Browse Prior Art Database

Solder Stripper Device

IP.com Disclosure Number: IPCOM000082142D
Original Publication Date: 1973-Nov-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 67K

Publishing Venue

IBM

Related People

Schumacher, LJ: AUTHOR [+2]

Abstract

Solder removal from plated holes or components in circuit cards is usally difficult and requires the use of a vacuum device, to remove solder after it has been heated to a molten state. By subjecting molten solder to centrifugal force, however, the solder can be readily removed to permit replacement or salvage of components.

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Solder Stripper Device

Solder removal from plated holes or components in circuit cards is usally difficult and requires the use of a vacuum device, to remove solder after it has been heated to a molten state. By subjecting molten solder to centrifugal force, however, the solder can be readily removed to permit replacement or salvage of components.

In the figure, a drum 1 is rotated about axis 2 and supports on the drum periphery pairs of spaced brackets 3, into which circuit cards 4 can be removably inserted. The circuit cards are mounted with the components, if any, next to the drum periphery. Surrounding the drum 1 is a support ring 6 on which is mounted a plurality of radiant, infrared heating elements 7, which are each focused to a common narrow band of drum surface. The support ring is held in position by a plurality of cables 8 which pass over pulleys 9 and pass down through columns
10. The cables are commonly connected to a winch type of device, not shown, which can wind or unwind the cables so as to cause the support ring 6 to move vertically with respect to the drum surface. The support ring, when located in its lowermost position, is above the band of drum surface which is heated by the energy sources.

As the drum 1 rotates, energy sources 7 heat a band of solder joints on the circuit cards. As solder becomes molten, it is flung outwardly away from the circuit cards and the support ring 6 is slowly raised to allow solder on a new band of holes or leads...