Browse Prior Art Database

Water Developable Photosensitive Dielectric

IP.com Disclosure Number: IPCOM000082260D
Original Publication Date: 1974-Nov-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Canestaro, MJ: AUTHOR [+2]

Abstract

This technique relates to an approach to the making of photosensitive dielectrics which are water developable, and which enhances the development of a unique photosensitive epoxy system.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 1

Water Developable Photosensitive Dielectric

This technique relates to an approach to the making of photosensitive dielectrics which are water developable, and which enhances the development of a unique photosensitive epoxy system.

A reaction occurs between certain polyamide resins and acrylic acid which results in a photosensitive product. When polyamide resins, such as Shell's "V- 40" or Dow's "DEH-14", are mixed with equal volumes of acrylic acid, an exotherming reaction occurs. To the product of this reaction 2-tert- butylanthraquinone is added as a sensitizing agent. The sensitized mixture is spin coated onto a copper substrate, then pattern exposed, and then developed in running tap water. The now imaged copper substrate is baked and then subjected to a flux-solder operation.

The above system lends to a unique approach to making photosensitive epoxy systems. In present epoxy systems, it is necessary to incorporate an epoxy hardener into the system during synthesis in order to achieve adequate sensitivity. By generating an image out of the polyamide resin, which is also an epoxy hardening agent, it is possible by solvent diffusion to incorporate the epoxy resin into an already developed image. Thus, epoxy and hardener are not premixed and subject to gelation on the board.

1