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Aluminum Contacting Probe

IP.com Disclosure Number: IPCOM000082288D
Original Publication Date: 1974-Nov-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 59K

Publishing Venue

IBM

Related People

McKnight, SR: AUTHOR

Abstract

This is a device for probing (contacting specified areas) silicone wafers 11 at the aluminum deposition level. The material of each probe wire 1 is 0.003'' dia. tungsten with an etched tip 8. Each probe wire is one piece from the probe tip 8 to the solder point 9 located under the cap 5 and epoxy 6. The advantages of this assembly are: 1. Probe and space transformer are one unit. 2. No contact resistance between probe and space transformer. 3. Assembly requires no special interconnection plates or connectors (uses standard connectors 3).

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Aluminum Contacting Probe

This is a device for probing (contacting specified areas) silicone wafers 11 at the aluminum deposition level. The material of each probe wire 1 is 0.003'' dia. tungsten with an etched tip 8. Each probe wire is one piece from the probe tip 8 to the solder point 9 located under the cap 5 and epoxy 6.

The advantages of this assembly are:
1. Probe and space transformer are one unit.
2. No contact resistance between probe and space transformer.
3. Assembly requires no special interconnection plates or

connectors (uses standard connectors 3).

The probe wires 1 are cut to approximate length, etched to the desired point 8, or radius, or both, and nickel plated on soldered end 9. Once this is completed, the probe wires 1 are inserted into the buckling beam probe dies 7 and mounted into the housing 10 which, in turn, is fastened to the printed-circuit board 2. The wires 1 are planarized by pushing them all parallel to the bottom die.

Once this is accomplished, a small amount of epoxy is placed around the probe wires 1 at the top of the probe die 7. After curing of the epoxy around the top die the probe 7 is now planarized, and the probe wires 1 can be soldered to the desired positions on the printed circuit board 2.

The cap 5 is placed over the probe wires 1 on the printed-circuit board 2 after all wires are soldered in the desired positions 9. The cap 5 is filled with epoxy 6 and cured. The probe is now complete.

United States Patent No. 3,806,8...