Browse Prior Art Database

Thermally Enhanced Hermetic Seal System for Multichip Air Cooled Modules

IP.com Disclosure Number: IPCOM000082294D
Original Publication Date: 1974-Nov-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Ingram, CG: AUTHOR

Abstract

A cast ceramic cap 3 with recessed holes 4 and optional fins 5 is metalized on four edges. A KOVAR* "L" flange (0.010'' thick) 6 is brazed to these edges. This cap assembly is then seam brazed to a metalized border of a fully assembled tested multichip module substrate 7. A semiconductor chip 9 is shown in the recess 4 in Fig. 2.

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Thermally Enhanced Hermetic Seal System for Multichip Air Cooled Modules

A cast ceramic cap 3 with recessed holes 4 and optional fins 5 is metalized on four edges. A KOVAR* "L" flange (0.010'' thick) 6 is brazed to these edges. This cap assembly is then seam brazed to a metalized border of a fully assembled tested multichip module substrate 7. A semiconductor chip 9 is shown in the recess 4 in Fig. 2.

Prior to brazing, the bottom surface of the ceramic cap 3 is coated with a thin layer 8 (0.001'' - 0.002'') of thermal epoxy or (optionally) a thin layer of thermal grease. This is done to effect intimate thermal contact between the substrate 7 and the cap 3 over a maximum surface area. * Trademark of Westinghouse Electric Corp.

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