Browse Prior Art Database

Solder Bucket Pads Contactor

IP.com Disclosure Number: IPCOM000082296D
Original Publication Date: 1974-Nov-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Bruder, SI: AUTHOR [+2]

Abstract

Figs. 1 and 2 show a multilayer ceramic (MLC) substrate 1 held in the contactor 2. "Solder bucket pads contactor" 3 makes contact with solder buckets pads on substrate 1. Test probes 4 are free to move and probe contact pads within the test matrix.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Solder Bucket Pads Contactor

Figs. 1 and 2 show a multilayer ceramic (MLC) substrate 1 held in the contactor 2. "Solder bucket pads contactor" 3 makes contact with solder buckets pads on substrate 1. Test probes 4 are free to move and probe contact pads within the test matrix.

Also shown is a section of the solder bucket pads contactor 3 concept. Cantilever beam contacts 6 are welded to printed-circuit boards 5 conductive lands. The printed-circuit boards 5 are sandwiched between upper holding plate 7 and lower holding plate 8, and are held in position by screws and locating pins 10, as shown by Fig. 3. Solder bucket pads contactor 3 is able to move in the +Z and -Z direction, and to make and brake contacts with solder bucket pads on substrate 1. Lower holding plate 8,fastened with shafts 11, provide an accurate - Z movement in slide bushings 12. Printed-circuit board wired connector 9 provides an interface between the tester and solder bucket pads contactor 3.

1

Page 2 of 2

2

[This page contains 4 pictures or other non-text objects]