Browse Prior Art Database

Variable Pitch Transfer Mechanism

IP.com Disclosure Number: IPCOM000082319D
Original Publication Date: 1974-Nov-01
Included in the Prior Art Database: 2005-Feb-28
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Rajac, TJ: AUTHOR

Abstract

Described is an apparatus for carrying out the bulk transfer of semiconductor wafers from a first carrier having a first interwafer spacing, to a second carrier having a second interwafer spacing.

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Variable Pitch Transfer Mechanism

Described is an apparatus for carrying out the bulk transfer of semiconductor wafers from a first carrier having a first interwafer spacing, to a second carrier having a second interwafer spacing.

The figure shows the variable-pitch transfer mechanism. The handle 2 mounted on the pivoted column 1 is connected to the linkage 3, which has a terminal point connected to the sliding member 10. Operation of the handle 2 in the leftward and the rightward horizontal directions, causes the sliding member 10 to slide in rightward and leftward directions, respectively, along the spiral slot 4 through guide shaft 5.

Spiral slot 4 has a continually changing radius vector with respect to the pivot column 1, such that the vertices 11 of the linkage 3 register above wafers 8 contained in the receptacle grooves of the carrier 6a when the sliding member 10 occupies the position 12a, and the vertices register over wafers contained in the receptacle grooves of the carrier 6b, when the sliding member is positioned along the slot 4 at position 12b.

Attached to each vertex 11 of the linkage 3 is a vacuum chuck 9. When the sliding member 10 is in position 12a along the slot 4, for example, displacing handle 2 in the downward position will cause the vacuum chucks 9 at the vertices 11, to contact and retain the wafers 8. The pivot column 1 can then be raised by the handle 2 in the upward direction and displaced leftward, such that the sliding member 10 as...